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http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a features outline dimension single chip super high brightness of surface mount led sorting for iv and vf @ 5ma of if compact package outline (lxwxt) of 1.6mm x 0.8mm x 0.4mm compatible to ir reflow soldering. applications backlighting (switches, keys, etc.) marker lights (e.g. steps, exit ways, etc.) recommended solder pad top side bottom anode cathode anode cathode tg wt/bl/yg/yl/or/hr absolute maximum rating 5b

directivity va l u e item symbo l wt/bl/tg yg/yl/or/hr unit dc forward current i f 30 30 ma pulse forward current* i fp 100 100 ma reverse voltage v r 5 5 v power dissipation p d 100 70 mw operating temperature topr -40 ~ +85
storage temperature tstg -40~ +85
lead soldering temperature tsol 260
/5sec *pulse width max 0.1ms, duty ratio max 1/10 electrical -optical charac teristics 5b

v f (v) i r (a) iv(mcd) d(nm) 2 1/2(deg) min. typ. max. max. min. typ. max. min. typ. max. typ. part number color i f =5ma v r =5v i f =5ma oswt0603c1a white wt ? 2.7 2.9 3.2 100 37 74 110 x=0.27, y=0.28 120 osbl0603c1a blue bl ? 2.6 2.9 3.2 100 9 23 37 465 470 475 120 ostg0603c1a true green tg ? 2.6 2.9 3.1 10* 60 103 145 520 525 530 120 osyg0603c1a yellow green yg ? 1.7 1.9 2.2 100 6 11 16 565 570 575 120 osyl0603c1a yellow yl ? 1.7 1.9 2.2 100 27 40 71 586 590 592 120 osor0603c1a orange or ? 1.7 1.9 2.2 100 18 35 60 600 605 610 120 OSHR0603C1A red hr ? 1.7 1.9 2.2 100 18 35 60 620 625 630 120 note: * vf tolerance: 0.05v *true green v r =4v * dominant wavelength tolerance: 1nm * luminous intensity is nist reading. luminous intensity tolerance:10% led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a optical and electrical characteristics typical electrical/optical characteristic curves led & application technologies ' p s x b s e 7 p m u b h f 7 g 7
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http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a recommended soldering temperature ? time profile (reflow soldering) surface mounting condition in automatic mounting of the smd leds on prin ted circuit boards, any bending, expanding and pulling forces or shock against the smd leds should be kept min. to prevent them from electrical failures and mechanical damages of the devices. soldering reflow -soldering of the smd leds should conform to the so ldering condition in the individual specifications. -smd leds are designed for reflow soldering. -in the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices. -we cannot guarantee the leds a fter they have been assembled using the solder dipping method. led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a 3) manual soldering conditions. - lead solder max. 300 for max. 3sec, and only one time.
- lead-free solder max. 350 for max. 3sec, and only one time.
- there is possibility that the brightness of leds is decreased, which is influenced by heat or ambient atmosphere during reflow. it is recommended to use the nitrogen reflow method. - after leds have been soldered, repair should not be done. as repair is unavoidable, a double-head soldering iron should be used. it should be confirme d beforehand whether the characteristics of the leds will be damaged by repairing or not. - reflow soldering should not be done more than two times. led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a material true green j white/ blue/ yellow green/ yellow/ orange/ red j led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a taping and orientation. quantity: 4,000 units/reel diameter: 178 mm general tolerance : 0.1 cautions: 1. after open the package, the led should be kept at 30 c, 30%rh or less. the led should be soldered within 24 hours (1 day) after opening the package. 2. heat generation must be taken into design consideration when using the led. 3. power must be applied resistors for protection, over current would be caused the optic damage to the devices and wavelength shift. 4. manual tip solder may cause the damage to chip devices, so advised that heat of iron should be lower than 15w with temperature control under 5 seconds at 230-260 deg. c. ( the device would be got damage in re working process, recommended under 5 seconds at 230-260 deg. c) 5. all equipment and machinery must be properly grounded. it is recommended to use a wristband or anti-electrostatic glove when handing the led. 6. use ipa as a solvent for cleaning the led. the other solvent may dissolve the led package and the epoxy, ultrasonic cleaning should not be done. 7. damaged led will show unusual characteristics such as leak current remarkably increase, turn-on voltage becomes lower and the led get unlight at low current. led & application technologies
http://www.optosupply.com ver a.0 1 1 . . 6 6 x x 0 0 . . 8 8 x x 0 0 . . 4 4 m m m m s s m m d d osxx0603c1a reliability test : conclusions: the reliability tests were designed to evaluate both package integrity as well as workability of product performance over time. all samples have done well by completed test requirement and passed all the qualification criteria with zero failure. from design standpoint, the package is robust enough to meet its datasheet conditions. based on the good result shows on the above test, this product is qualified and released for market. led & application technologies

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